Indian Electronics and Semiconductor manufacturing industry

rithwik123

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Tata Group lines up over Rs 7,600 crore to fund its electronics business: Report

The Tata Group has reportedly lined up funds for its greenfield electronic component and contract manufacturing business through Tata Electronics. It has lined up funds of over Rs 7,600 crore through a mix of capital infusion by the parent and secured loans, as per a media report.

 

Lonewolf

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Tata Group lines up over Rs 7,600 crore to fund its electronics business: Report

The Tata Group has reportedly lined up funds for its greenfield electronic component and contract manufacturing business through Tata Electronics. It has lined up funds of over Rs 7,600 crore through a mix of capital infusion by the parent and secured loans, as per a media report.

Just shy of a billion, too less for what they are aiming but good for a start
 

thebakofbakchod

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I5 ya I7 copy karna tha. Mast low cost CPU ban jata
Chinkus can afford these kind of scams because they have dozens of companies that do actual manufacturing. SMIC has a fully indigenous domestic supply chain down to the equipment level for 14nm, something i doubt even the US has, since they do rely on suppliers like Tokyo electron, ASML etc for some equipment components. Plus both the central and local governments will throw unlimited money at local companies.


here is 1 city alone throwing our entire PLI budget at a failed scam company. Our semicon ambitions will be a complete failure because no Indian private company will invest in it. None have either the money, ambition or expertise to do it. We will need a state backed venture similar to Maruti or other PSUs to build a factory at any cost, at a 28nm or above node
 

shade

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is 1 city alone throwing our entire PLI budget at a failed scam company. Our semicon ambitions will be a complete failure because no Indian private company will invest in it. None have either the money, ambition or expertise to do it. We will need a state backed venture similar to Maruti or other PSUs to build a factory at any cost, at a 28nm or above node
This is the only solution, private sector are too cucked to put money in a "risky" venture.
 

Tvashtr8202

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Google, is exploring the possibility of shifting a portion of its Pixel smartphone production to India, according to a report by Bloomberg. The company has initiated early discussions with domestic suppliers as it looks to capitalise on India's growing potential as a manufacturing hub.

In Google's case, the company has engaged in talks with prominent Indian suppliers such as Lava International Ltd, Dixon Technologies India, and Bharat FIH, the Indian unit of Foxconn Technology Group.

It's great that India companies are now into contract based manufacturing & are being actively engaged by international brands for making their products in India.
 

shade

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Micron OSAT plant approved, they will receive $1.34 billion incentives from the Semiconductor PLI scheme, plant will come up in Sanand, Gujurat.

News is based on sutro se pata chala hai so take it with a spoon of salt before getting all hyped
 

Indx TechStyle

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New Delhi wants Indian heads for Chinese Xiaomi, Vivo, Oppo. It’s mirroring China’s practice
China has accused India of using strong-arm tactics against its mobile phone makers such as Xiaomi, Vivo, Oppo and Realme.
Recently, India’s Directorate of Enforcement (ED) issued show cause notices to Xiaomi’s CFO Sameer Rao, former MD Manu Jain and three foreign banks (CITI, HSBC and Deutsche Bank AG) for violating foreign exchange rules by allegedly laundering Rs 5,551.27 crore. The Directorate had earlier seized Xiaomi’s funds in April and accused the company of remitting it on behalf of its parent company in China.
Now, the government has asked the Chinese mobile phone manufacturers to appoint Indian citizens as equity partners and executives among a slew of other measures to tie the companies to India.
Beijing has a history of appointing Chinese nationals as the heads of foreign companies operating in the mainland. India is merely catching with what China has practised within its territory for many years.
 

shade

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ITS CONFIRMED :cruisin2:

Micron confirms up to $825 million investment in India chip facility


OAKLAND, California (Reuters) – U.S. memory chip firm Micron Technology, Inc said on Thursday it would invest up to $825 million in a new chip assembly and test facility in Gujarat, India, its first factory in the country.

Micron said that with support from the Indian central government and from the state of Gujarat, the total investment in the facility will be $2.75 billion. Of that total, 50% will come from the Indian central government and 20% from the state of Gujarat.

Reuters reported earlier this week that India’s Cabinet approved the project ahead of Prime Minister Narendra Modi’s state visit to the U.S., which kicked off on Wednesday.

Micron said construction of the new facility in Gujarat is expected to begin in 2023 and the first phase of the project will be operational in late 2024. A second phase of the project is expected to start toward the second half of the decade, it said. The two phases together will create up to 5,000 new direct Micron jobs.


Official Micron Press Release with more details :- https://investors.micron.com/news-r...-new-semiconductor-assembly-and-test-facility


From Press Release I found this line

Micron’s new facility will focus on transforming wafers into ball grid array (BGA) integrated circuit packages, memory modules and solid-state drives.
Now usually in OSAT plant they just put the little IC die into a ceramic or plastic package with the leads coming out + electrical testing, surprised they're going to make DIMM sticks and SSDs also.
 

Tvashtr8202

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Micron -

New DRAM and NAND assembly and test facility - the first in India - will expand Micron's global manufacturing base to meet future demand

BOISE, Idaho, June 22, 2023 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (NASDAQ: MU), one of the world's largest semiconductor companies, today announced plans to build a new assembly and test facility in Gujarat, India. Micron's new facility will enable assembly and test manufacturing for both DRAM and NAND products and address demand from domestic and international markets.

Phased construction of the new assembly and test facility in Gujarat is expected to begin in 2023. Phase 1, which will include 500,000 square feet of planned cleanroom space, will start to become operational in late 2024, and Micron will ramp capacity gradually over time in line with global demand trends. Micron expects Phase 2 of the project, which would include construction of a facility similar in scale to Phase 1, to start towards the second half of the decade.

Micron's investment will be up to $825 million over the two phases of the project and will create up to 5,000 new direct Micron jobs and 15,000 community jobs over the next several years. Under the government's "Modified Assembly, Testing, Marking and Packaging (ATMP) Scheme," Micron will receive 50% fiscal support for the total project cost from the Indian central government and incentives representing 20% of the total project cost from the state of Gujarat. The combined investment by Micron and the two government entities over the course of both phases will be up to $2.75 billion. Government support will help fund the project and facilitate access to essential semiconductor infrastructure and resources to drive innovation and enhance local talent development.

"We are excited about the steps India is taking to develop the local semiconductor ecosystem," said Micron President and CEO Sanjay Mehrotra. "I am grateful to the Indian government and all of the officials involved that made this investment possible. Our new assembly and test location in India will enable Micron to expand our global manufacturing base and better serve our customers in India and around the world."
FzOvlL4WwAA4C3V.jpeg

 

shade

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Part of the headline is what librandus will copy pasta to downplay this

Truth is what this Micron facility will do is make DRAM and Flash chips into products that can be used in actual electronics as either a vital subcomponent or sold to consumers(as RAM and SSD under the Crucial brand ).

They will receive 300mm wafers from some foreign country with the chips fabricated on them like this

1687541541081.png


Via a machine these chips will be cut out of the disc and placed into a package made out of plastic or some other material, this is to protect the bare die( the "chip" ) from dust, moisture etc, a bare die is very sensitive to the environment, hence this package is fully sealed, except the leads which only transfer electricity.

1687541631380.png


leads from the package which go outside will also be connected to the die for electrical connections

Later these packaged chips are rigourously tested for any defects, and then shipped to customers.

This diagram below shows the main steps in IC manufacturing

1687541716795.png


OSAT/ATMP is the final step in this, afterwards the chips can be used in electronics products of other manufacturers.

This is a chip with the packaging burnt away via acid to reveal the IC die and the bonding wires which go to the leads

1687541777841.png


Most modern chips have a BGA package which has little solder balls under the chip instead of the typical metal leads from the side

1687541894835.png



When these products are exported, they will say Made In India on the package :troll:
 

Hari Sud

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Part of the headline is what librandus will copy pasta to downplay this

Truth is what this Micron facility will do is make DRAM and Flash chips into products that can be used in actual electronics as either a vital subcomponent or sold to consumers(as RAM and SSD under the Crucial brand ).

They will receive 300mm wafers from some foreign country with the chips fabricated on them like this

View attachment 211785

Via a machine these chips will be cut out of the disc and placed into a package made out of plastic or some other material, this is to protect the bare die( the "chip" ) from dust, moisture etc, a bare die is very sensitive to the environment, hence this package is fully sealed, except the leads which only transfer electricity.

View attachment 211786

leads from the package which go outside will also be connected to the die for electrical connections

Later these packaged chips are rigourously tested for any defects, and then shipped to customers.

This diagram below shows the main steps in IC manufacturing

View attachment 211787

OSAT/ATMP is the final step in this, afterwards the chips can be used in electronics products of other manufacturers.

This is a chip with the packaging burnt away via acid to reveal the IC die and the bonding wires which go to the leads

View attachment 211788

Most modern chips have a BGA package which has little solder balls under the chip instead of the typical metal leads from the side

View attachment 211789


When these products are exported, they will say Made In India on the package :troll:
‘Good to know the details of Micron’s manufacturing in India.
 

Blademaster

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Part of the headline is what librandus will copy pasta to downplay this

Truth is what this Micron facility will do is make DRAM and Flash chips into products that can be used in actual electronics as either a vital subcomponent or sold to consumers(as RAM and SSD under the Crucial brand ).

They will receive 300mm wafers from some foreign country with the chips fabricated on them like this

View attachment 211785

Via a machine these chips will be cut out of the disc and placed into a package made out of plastic or some other material, this is to protect the bare die( the "chip" ) from dust, moisture etc, a bare die is very sensitive to the environment, hence this package is fully sealed, except the leads which only transfer electricity.

View attachment 211786

leads from the package which go outside will also be connected to the die for electrical connections

Later these packaged chips are rigourously tested for any defects, and then shipped to customers.

This diagram below shows the main steps in IC manufacturing

View attachment 211787

OSAT/ATMP is the final step in this, afterwards the chips can be used in electronics products of other manufacturers.

This is a chip with the packaging burnt away via acid to reveal the IC die and the bonding wires which go to the leads

View attachment 211788

Most modern chips have a BGA package which has little solder balls under the chip instead of the typical metal leads from the side

View attachment 211789


When these products are exported, they will say Made In India on the package :troll:
Great post! Can you do a similar post on other phases of semiconductor manufacturing?
 

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