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He has amassed 220 cr wealth over the yearsBe like him, useless overhyped technocrat.
He has amassed 220 cr wealth over the yearsBe like him, useless overhyped technocrat.
what's the point of contention with minister's statement?Be like him, useless overhyped technocrat.
Just shy of a billion, too less for what they are aiming but good for a startTata Group lines up over Rs 7,600 crore to fund its electronics business: Report
The Tata Group has reportedly lined up funds for its greenfield electronic component and contract manufacturing business through Tata Electronics. It has lined up funds of over Rs 7,600 crore through a mix of capital infusion by the parent and secured loans, as per a media report.
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Tata Group lines up over Rs 7,600 crore to fund its electronics business: Report
The filings made to the Registrar of Companies (RoC) suggest that Tata Electronics received over Rs 608 crore capital infusion in 2022-23 from its holding company Tata Sons.www.businesstoday.in
Chinkus can afford these kind of scams because they have dozens of companies that do actual manufacturing. SMIC has a fully indigenous domestic supply chain down to the equipment level for 14nm, something i doubt even the US has, since they do rely on suppliers like Tokyo electron, ASML etc for some equipment components. Plus both the central and local governments will throw unlimited money at local companies.
I5 ya I7 copy karna tha. Mast low cost CPU ban jata
‘Chinese the top copy masters of the world.
I5 ya I7 copy karna tha. Mast low cost CPU ban jata
This is the only solution, private sector are too cucked to put money in a "risky" venture.is 1 city alone throwing our entire PLI budget at a failed scam company. Our semicon ambitions will be a complete failure because no Indian private company will invest in it. None have either the money, ambition or expertise to do it. We will need a state backed venture similar to Maruti or other PSUs to build a factory at any cost, at a 28nm or above node
Indias private sector barely invest in RMG plants or basic electronic plants and idiots want them to invest in semiconductors. Not happening. Sooner the gormint understands the betterThis is the only solution, private sector are too cucked to put money in a "risky" venture.
Bhagwan keliye kuch ho jaye
China has accused India of using strong-arm tactics against its mobile phone makers such as Xiaomi, Vivo, Oppo and Realme.
Recently, India’s Directorate of Enforcement (ED) issued show cause notices to Xiaomi’s CFO Sameer Rao, former MD Manu Jain and three foreign banks (CITI, HSBC and Deutsche Bank AG) for violating foreign exchange rules by allegedly laundering Rs 5,551.27 crore. The Directorate had earlier seized Xiaomi’s funds in April and accused the company of remitting it on behalf of its parent company in China.
Now, the government has asked the Chinese mobile phone manufacturers to appoint Indian citizens as equity partners and executives among a slew of other measures to tie the companies to India.
Beijing has a history of appointing Chinese nationals as the heads of foreign companies operating in the mainland. India is merely catching with what China has practised within its territory for many years.
Now usually in OSAT plant they just put the little IC die into a ceramic or plastic package with the leads coming out + electrical testing, surprised they're going to make DIMM sticks and SSDs also.Micron’s new facility will focus on transforming wafers into ball grid array (BGA) integrated circuit packages, memory modules and solid-state drives.
‘Good to know the details of Micron’s manufacturing in India.![]()
Micron won't make but pack chips in India. Know why it's so vital
U.S. chipmaker Micron Technology plans a $2.7 billion semiconductor testing and packaging unit in Gujarat. As innovation in design and packaging encounters limits, these days advances in chip performance rely more on the back end of production, including packaging,economictimes.indiatimes.com
Part of the headline is what librandus will copy pasta to downplay this
Truth is what this Micron facility will do is make DRAM and Flash chips into products that can be used in actual electronics as either a vital subcomponent or sold to consumers(as RAM and SSD under the Crucial brand ).
They will receive 300mm wafers from some foreign country with the chips fabricated on them like this
View attachment 211785
Via a machine these chips will be cut out of the disc and placed into a package made out of plastic or some other material, this is to protect the bare die( the "chip" ) from dust, moisture etc, a bare die is very sensitive to the environment, hence this package is fully sealed, except the leads which only transfer electricity.
View attachment 211786
leads from the package which go outside will also be connected to the die for electrical connections
Later these packaged chips are rigourously tested for any defects, and then shipped to customers.
This diagram below shows the main steps in IC manufacturing
View attachment 211787
OSAT/ATMP is the final step in this, afterwards the chips can be used in electronics products of other manufacturers.
This is a chip with the packaging burnt away via acid to reveal the IC die and the bonding wires which go to the leads
View attachment 211788
Most modern chips have a BGA package which has little solder balls under the chip instead of the typical metal leads from the side
View attachment 211789
When these products are exported, they will say Made In India on the package![]()
Great post! Can you do a similar post on other phases of semiconductor manufacturing?![]()
Micron won't make but pack chips in India. Know why it's so vital
U.S. chipmaker Micron Technology plans a $2.7 billion semiconductor testing and packaging unit in Gujarat. As innovation in design and packaging encounters limits, these days advances in chip performance rely more on the back end of production, including packaging,economictimes.indiatimes.com
Part of the headline is what librandus will copy pasta to downplay this
Truth is what this Micron facility will do is make DRAM and Flash chips into products that can be used in actual electronics as either a vital subcomponent or sold to consumers(as RAM and SSD under the Crucial brand ).
They will receive 300mm wafers from some foreign country with the chips fabricated on them like this
View attachment 211785
Via a machine these chips will be cut out of the disc and placed into a package made out of plastic or some other material, this is to protect the bare die( the "chip" ) from dust, moisture etc, a bare die is very sensitive to the environment, hence this package is fully sealed, except the leads which only transfer electricity.
View attachment 211786
leads from the package which go outside will also be connected to the die for electrical connections
Later these packaged chips are rigourously tested for any defects, and then shipped to customers.
This diagram below shows the main steps in IC manufacturing
View attachment 211787
OSAT/ATMP is the final step in this, afterwards the chips can be used in electronics products of other manufacturers.
This is a chip with the packaging burnt away via acid to reveal the IC die and the bonding wires which go to the leads
View attachment 211788
Most modern chips have a BGA package which has little solder balls under the chip instead of the typical metal leads from the side
View attachment 211789
When these products are exported, they will say Made In India on the package![]()