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The Taiwanese government has given its approval for TSMC to build a 16nm FinFET 300mm semiconductor fabrication plant in mainland China. The $3 billion wafer fab will start operation in the second half of 2018.
Currently, the most advanced semiconductor fabrication on mainland China is conducted by SMIC at 28nm.
TSMC's 16nm FinFET will move China forward by two generations of semiconductor fabrication technology.
28nm ---> 20nm ---> 16nm FinFET
Also, the 16nm FinFET plant can be later upgraded to 10nm.
In conclusion, TSMC's $3 billion investment in mainland China is a boost to the Chinese semiconductor industry.
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TSMC's 300mm Chinese Wafer Fab Wins Approval | EE Times
Currently, the most advanced semiconductor fabrication on mainland China is conducted by SMIC at 28nm.
TSMC's 16nm FinFET will move China forward by two generations of semiconductor fabrication technology.
28nm ---> 20nm ---> 16nm FinFET
Also, the 16nm FinFET plant can be later upgraded to 10nm.
In conclusion, TSMC's $3 billion investment in mainland China is a boost to the Chinese semiconductor industry.
----------
TSMC's 300mm Chinese Wafer Fab Wins Approval | EE Times