China catches up with US in etch equipment manufacturing | Electronics Weekly
China has caught up with the USA in the manufacture of etching equipment.
The achievement has been recognised by the US Department of Commerce lifting the export ban on US-made etching equipment.
The ban has been in pace for 20 years. To get it lifted it was necessary to prove that local sources could manufacture machines to the same standard as the US companies.
The case was proven through representations by SEMI to the DoC.
"SEMI is pleased to have facilitated a constructive dialogue with international industry participants and the US government in order to pursue updated and appropriate levels of export control," said SEMI vice-president Jonathan Davis. "The decontrol of semiconductor etch technology is a necessary recognition of modern commercial realities and will contribute to a level field of competition."
Anistropic plasma dry etching equipment designed or optimised to produce critical dimensions of 65nm or less within specific uniformity capabilities is controlled in the US by the Department of Commerce for national security reasons.
Considered a dual-use technology, advanced etch equipment can be used for both civil and military applications.
While the technology can be used to produce devices for military application, the vast majority of commercial etch technology is used by semiconductor manufacturers that produce ICs.
- See more at: China catches up with US in etch equipment manufacturing | Electronics Weekly
China has caught up with the USA in the manufacture of etching equipment.
The achievement has been recognised by the US Department of Commerce lifting the export ban on US-made etching equipment.
The ban has been in pace for 20 years. To get it lifted it was necessary to prove that local sources could manufacture machines to the same standard as the US companies.
The case was proven through representations by SEMI to the DoC.
"SEMI is pleased to have facilitated a constructive dialogue with international industry participants and the US government in order to pursue updated and appropriate levels of export control," said SEMI vice-president Jonathan Davis. "The decontrol of semiconductor etch technology is a necessary recognition of modern commercial realities and will contribute to a level field of competition."
Anistropic plasma dry etching equipment designed or optimised to produce critical dimensions of 65nm or less within specific uniformity capabilities is controlled in the US by the Department of Commerce for national security reasons.
Considered a dual-use technology, advanced etch equipment can be used for both civil and military applications.
While the technology can be used to produce devices for military application, the vast majority of commercial etch technology is used by semiconductor manufacturers that produce ICs.
- See more at: China catches up with US in etch equipment manufacturing | Electronics Weekly
